WLCSP reliability improvement for package edges including package shielding

US11990408B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Thomas Wagner · Regelsbach, DE
• Jan Proschwitz · Riesa, DE

Key dates

• Filing date: Mar 27, 2020
• Grant date: May 21, 2024
• Expiry date: Aug 7, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3512
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a redistribution layer (RDL) having a conductive layer in a first dielectric layer, and a second dielectric layer over the conductive and first dielectric layers. The RDL comprises an extended portion having a first thickness that vertically extends from a bottom surface of the first dielectric layer to a topmost surface of the second dielectric layer. The electronic package comprises a die on the RDL, where the die has sidewall surfaces, a top surface, and a bottom surface that is opposite from the top surface, and an active region on the bottom surface of the die. The first thickness is greater than a second thickness of the RDL that vertically extends from the bottom surface of the first dielectric layer to the bottom surface of the die. The extended portion is over and around the sidewall surfaces.