Patent · US Active

Apparatus and method for laser machining a workpiece

US11992897B2 · kind B2 · utility

0Cited by

2References

15Claims

0Family size

Assignee

TRUMPF LASER- UND SYSTEMTECHNIK GMBH · DE

Inventors

Tim Hesse · Ditzingen, DE
Daniel Flamm · Walnut Creek, US
Myriam Kaiser · Ditzingen, DE

Key dates

Filing date	Aug 1, 2023
Grant date	May 28, 2024
Priority date	—
Expiry date	Aug 1, 2043

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/54
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An apparatus for laser machining a workpiece in a machining plane includes a first laser machining unit for forming a first focal zone which extends in a first main direction of extent, and at least one further laser machining unit for forming at least one further focal zone which extends in a further main direction of extent oriented transversely to the first main direction of extent. The first focal zone and the at least one further focal zone are spaced apart from one another parallel to the machining plane at a work distance. The first laser machining unit and the at least one further laser machining unit are movable in an advancement direction that is oriented parallel to the machining plane. The workpiece comprises a material that is transparent to a laser beam which respectively forms the first focal zone and the at least one further focal zone.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.