Substrate processing method and substrate processing apparatus
US11993841B2 · kind B2 · utility
0Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2020 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Aug 18, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a substrate processing method which includes placing a substrate on a stage provided inside a processing container, and forming a ruthenium film on the substrate, wherein forming the ruthenium film includes repeating a cycle including: supplying a ruthenium-containing gas and a CO gas into the processing container; and stopping the supply of the ruthenium-containing gas and the CO gas into the processing container and exhausting a gas within the processing container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.