Wafer processing apparatus
US11996270B2 · kind B2 · utility
0Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2021 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Jan 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus includes a chamber body including a cavity region and a process region; a microwave waveguide configured to introduce a microwave into the cavity region; a first microwave window between the cavity region and the process region; and a magnetic field supplying device configured to apply a magnetic field inside the chamber body, wherein a thickness of the first microwave window is constant, and the first microwave window is configured to control a beam cross-section of the microwave in the process region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.