Packaged semiconductor device including liquid-cooled lid and methods of forming the same
US11996351B2 · kind B2 · utility
15Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2022 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Jun 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.