Bulk ruthenium chemical mechanical polishing composition

US11999876B2 · kind B2 · utility

Assignee

• Fujifilm Electronic Materials U.S.A., Inc. · US

Inventors

• David (Tawei) Lin · Chandler, US
• Bin Hu · Mesa, US
• Liqing Wen · Mesa, US
• Yannan Liang · Gilbert, US
• Ting-Kai Huang · 溪州鄉, TW

Key dates

• Filing date: Feb 11, 2022
• Grant date: Jun 4, 2024
• Expiry date: Feb 11, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The compositions of the present disclosure polish surfaces or substrates that at least partially include ruthenium. The composition includes a synergistic combination of ammonia and oxygenated halogen compound. The composition may further include abrasive and acid(s). A polishing composition for use on ruthenium materials may include ammonia, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; hydrogen periodate, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; silica, present in an amount of 0.01 wt % to 12 wt %, based on the total weight of the composition; and organic sulfonic acid, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition, wherein the pH of the composition is between 6 and 8.