Pellicle intermediary body, pellicle, method for manufacturing of pellicle intermediary body, and pellicle manufacturing method
US12001136B2 · kind B2 · utility
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3References
8Claims
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Key dates
| Filing date | Feb 21, 2020 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Jun 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/62
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A pellicle intermediary body, a pellicle, a method for manufacturing a pellicle intermediary body, and a pellicle manufacturing method are provided. A pellicle intermediary body has a Si substrate, a Si oxide film formed on a surface of the Si substrate, and a Si layer formed on a surface of the Si oxide film. The Si layer includes a low COP (Crystal Originated Particle) portion which is a part where the number of COPs decreases as it approaches the surface of the Si layer and is formed in the part that constitutes the surface of the Si layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.