Patent · US Active

Semiconductor device including an embedded semiconductor die

US12002739B2 · kind B2 · utility

0Cited by

0References

18Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Edward Fuergut · Nuremberg, DE
Achim Althaus · Regensburg, DE
Martin Gruber · Schwandorf, DE
Marco Mueller · Villach, AT
Bernd Schmoelzer · Radenthein, AT
Wolfgang Scholz · Minden, DE
Mark A. Thomas · Solihull, GB

Key dates

Filing date	Feb 11, 2021
Grant date	Jun 4, 2024
Priority date	—
Expiry date	May 30, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3512
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a die carrier, a semiconductor die disposed on a main face of the die carrier, the semiconductor die including one or more contact pads, an encapsulant covering at least partially the semiconductor die and at least a portion of the main face of the die carrier, an insulation layer covering the encapsulant, and one or more electrical interconnects, each being connected with one of the one or more contact pads of the semiconductor die and extending through the encapsulant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.