Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
US12002793B2 · kind B2 · utility
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16References
8Claims
0Family size
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Key dates
| Filing date | Aug 2, 2021 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Aug 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.