Optoelectronic semiconductor component

US12002901B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karl Weidner · Birkenfeld, DE
• Ralph Wirth · Lappersdorf, DE
• Axel Kaltenbacher · Ingolstadt, DE
• Walter Wegleiter · Nittendorf, DE
• Bernd Barchmann · Regensburg, DE
• Oliver Wutz · Regensburg, DE
• Jan Marfeld · Regensburg, DE

Key dates

• Filing date: Jun 22, 2023
• Grant date: Jun 4, 2024
• Expiry date: Jun 22, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/853
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.