Wiring board and production method for same
US12004305B2 · kind B2 · utility
1Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2019 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Dec 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.