Electrically conductive vias and methods for producing same
US12009225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Mar 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/15
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.