Daniel Long
5Patents
3h-index
13Co-inventors
43Inventor score
Filing activity: Jan 3, 2018 → Sep 30, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10593562B2 | Method for creating through-connected vias and conductors on a substrate | Electricity | 4 | Active |
| US11107702B2 | Method for creating through-connected vias and conductors on a substrate | Electricity | 4 | Active |
| US10727084B2 | Method for creating through-connected vias and conductors on a substrate | Electricity | 3 | Active |
| US12100647B2 | Electrically conductive vias and methods for producing same | Electricity | 0 | Active |
| US12009225B2 | Electrically conductive vias and methods for producing same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.