High power multilayer module having low inductance and fast switching for paralleling power devices
US12010823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2020 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Mar 31, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.