Apparatus and method for physical vapor deposition
US12014912B2 · kind B2 · utility
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2References
20Claims
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Key dates
| Filing date | May 5, 2021 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Nov 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for physical vapor deposition includes a magnetron having a plurality of electromagnets disposed between a base and a magnetic conductive plate. The magnetron includes a plurality of individually controlled electromagnets between a base and an electromagnetic plate. The magnetron controls the polarity and strength of current supplied to the respective electromagnets to generate magnetic fields that confine electrons to areas near a target material within the deposition chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.