Yu-Young Wang
11Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: Apr 27, 2012 → Aug 10, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8803292B2 | Through-substrate vias and methods for forming the same | Electricity | 368 | Active |
| US8624324B1 | Connecting through vias to devices | Electricity | 8 | Active |
| US9355935B2 | Connecting through vias to devices | Electricity | 3 | Active |
| US10504776B2 | Methods for forming through-substrate vias penetrating inter-layer dielectric | Electricity | 2 | Active |
| US9123702B2 | Connecting through vias to devices | Electricity | 1 | Active |
| US10049965B2 | Through-substrate vias and methods for forming the same | Electricity | 0 | Active |
| US12014912B2 | Apparatus and method for physical vapor deposition | Electricity | 0 | Active |
| US12226807B2 | Cleaning device for cleaning electroplating substrate holder | Chemistry; Metallurgy | 0 | Active |
| US11713509B2 | Flow guide apparatus and vapor deposition device | Electricity | 0 | Active |
| US10307798B2 | Cleaning device for cleaning electroplating substrate holder | Chemistry; Metallurgy | 0 | Active |
| US11433440B2 | Cleaning device for cleaning electroplating substrate holder | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.