Semiconductor devices comprising a radar semiconductor chip and associated production methods
US12014998B2 · kind B2 · utility
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1References
20Claims
0Family size
Assignee
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Key dates
| Filing date | May 5, 2023 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | May 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/065
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.