Protective enclosure for an electronic device
US12016111B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2022 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Oct 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly's PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.