Inventor · San Jose, CA, US

Ning Ye

73Patents
8h-index
122Co-inventors
81Inventor score

Filing activity: Jun 9, 2000 → Jul 31, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10146768B2 Automatic suggested responses to images received in messages using language model Physics 17 Active
US9210213B2 Reverse seamless integration between local and remote computing environments Physics 15 Active
US7772686B2 Memory card fabricated using SiP/SMT hybrid technology Electricity 12 Active
US9736221B2 Reverse seamless integration between local and remote computing environments Physics 12 Active
US7778057B2 PCB circuit modification from multiple to individual chip enable signals Physics 12 Active
US8817511B2 PCB circuit modification from multiple to individual chip enable signals Physics 11 Active
US10854573B2 Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch Electricity 9 Active
US9761290B1 Overheat prevention for annealing non-volatile memory Electricity 9 Active
USD1002543S1 DC charging gun General 8 Active
USD698635S1 Double-sided hook push-chip type tubular member clamp General 6 Active
US8046695B2 Methods and systems for incorporating at least one window from a first desktop environment having a first themed graphical display into a second desktop environment having a second themed graphical display Physics 6 Active
US9899347B1 Wire bonded wide I/O semiconductor device Electricity 6 Active
US9773766B2 Semiconductor device including independent film layer for embedding and/or spacing semiconductor die Electricity 4 Active
US11393735B2 Semiconductor device including reinforced corner supports Electricity 3 Active
US7709278B2 Method of making PCB circuit modification from multiple to individual chip enable signals Physics 3 Active
US10200453B2 Reverse seamless integration between local and remote computing environments Physics 3 Active
US7534377B2 Borate crystals for optical frequency conversion Physics 3 Expired
US9228273B2 Nonlinear optical crystals and their manufacture and use Physics 3 Active
US10325881B2 Vertical semiconductor device having a stacked die block Electricity 3 Active
US7952179B2 Semiconductor package having through holes for molding back side of package Electricity 2 Active
US10855747B2 Reverse seamless integration between local and remote computing environments Physics 2 Active
US7611927B2 Method of minimizing kerf width on a semiconductor substrate panel Electricity 2 Active
US11679497B2 Distributed robotic demonstration learning Physics 1 Active
US6625186B1 Laser frequency doubling device of ReCa4O(BO3)3 crystal with specific cut angles Electricity 1 Expired
US11685047B2 Skill template distribution for robotic demonstration learning Physics 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.