Circuit board with a conductive bump mounted on an adhesive layer
US12016133B2 · kind B2 · utility
0Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2020 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Feb 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0038
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.