Package comprising an integrated passive device configured as a cap for a filter
US12016247B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Aug 27, 2020 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Oct 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1071
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The integrated passive device is coupled to the integrated device. The integrated passive device is configured as a cap for the integrated device. The void is located between the integrated device and the integrated passive device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.