Polishing head system and polishing apparatus
US12017323B2 · kind B2 · utility
0Cited by
7References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2021 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | May 5, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.