Patent · US Active

Sensor-based planar wafer probe alignment

US12019096B2 · kind B2 · utility

0Cited by

6References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Stefano DI MARTINO · Graz, AT
Thomas Thurner · Kirchheim unter Teck, DE

Key dates

Filing date	Apr 8, 2021
Grant date	Jun 25, 2024
Priority date	—
Expiry date	Sep 10, 2042

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2891
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A wafer probe alignment system includes a test probe needle including a body having a tip that is configured to make contact with a surface of a wafer at a first tip position, wherein the body is deformable and includes a sensing area that undergoes a deformation in response to at least one force, including a lateral friction force, applied to the tip; at least one sensor configured to monitor the sensing area for deformation caused by a lateral friction force and generate at least one first sensor information representative of the lateral friction force; and a controller configured to control a position of the tip, wherein the controller is configured to receive the at least one first sensor information and reposition the tip to counteract the lateral friction force in order to maintain the tip at the first tip position.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.