Method and system for classifying defects in wafer using wafer-defect images, based on deep learning
US12020417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2020 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Oct 15, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides method and system 100 for classifying defects in wafer using wafer defect images, based on deep learning network. Embodiments herein uses synergy between several modalities of the wafer defect images for the classification decision. Further, by adding a mixture of modalities, information may be obtained from different sources such as color image, ICI, the black and white image, to classify the defect image. In addition to mixture of modalities, a reference image may be used for each modality. The reference image of each modality image is provided to deep learning models to concentrate on the defect itself and not on the related underlying lithography of the defect image. Further, the reference image may be provided to the training process of the deep learning models that may significantly reduce the number of labelled images and the training epochs required for convergence of the deep learning model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.