Double-sided integrated circuit module having an exposed semiconductor die
US12021065B2 · kind B2 · utility
0Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2021 |
| Grant date | Jun 25, 2024 |
| Priority date | — |
| Expiry date | Oct 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.