John Robert Siomkos
14Patents
6h-index
18Co-inventors
63Inventor score
Filing activity: Jun 24, 1991 → Oct 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5379185A | Leadless surface mountable assembly | Electricity | 19 | Expired |
| US8351221B2 | Stacked shield compartments for electronic components | Electricity | 13 | Active |
| US9137934B2 | Compartmentalized shielding of selected components | Emerging Cross-Sectional Technologies | 11 | Active |
| US5160906A | Microstripe filter having edge flared structures | Electricity | 10 | Expired |
| US8313985B2 | Atomic layer deposition encapsulation for power amplifiers in RF circuits | Electricity | 7 | Active |
| US8440012B2 | Atomic layer deposition encapsulation for acoustic wave devices | Electricity | 6 | Active |
| US8492908B2 | Atomic layer deposition encapsulation for power amplifiers in RF circuits | Electricity | 5 | Active |
| US6259902A | Dual channel superheterodyne receiver | Electricity | 5 | Expired |
| US6184751A | Amplifier circuit | Electricity | 4 | Expired |
| US9325353B2 | Architecture for a radio frequency front-end | Electricity | 0 | Active |
| US9349938B2 | Atomic layer deposition encapsulation for acoustic wave devices | Electricity | 0 | Active |
| US9799444B2 | Reconfigurable directional coupler | Electricity | 0 | Active |
| US9082953B2 | Atomic layer deposition encapsulation for acoustic wave devices | Electricity | 0 | Active |
| US12021065B2 | Double-sided integrated circuit module having an exposed semiconductor die | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.