Liquid ejection head and manufacturing method thereof
US12023931B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Jul 26, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1645
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A manufacturing method of a liquid ejection head includes steps of providing an ejection orifice forming member on one surface of a wafer, with an energy-generating element being provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.