Multifunctional materials for temporary bonding
US12024594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Feb 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The materials and methods disclosed can be used for applications such as temporary bond and debond of semiconductor and display substrates. These materials have sufficiently low melt rheologies to be used as a bonding layer and can crosslink/cure to allow for reduction in material flow over long periods of time. This class of materials also incorporates the ability to be used as a single-layer system for debonding purposes and typically uses laser debonding for its release mechanism. These materials also allow for solvent cleanability using very mild acidic conditions instead of the typical harsh conditions used on curable layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.