Semiconductor apparatus including a plurality of dies operating as a plurality of channels
US12026399B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Aug 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1434
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes a substrate, a first die, and a second die. The substrate includes first and second byte pads of a first channel and first and second byte pad of a second channel. First byte pads of the first die are respectively coupled to the first byte pads of the first channel, and second byte pads of the first die are respectively coupled to the second byte pads of the first channel. The second die, as disposed, is rotated by 180° with respect to the first die. First byte pads of the second die are respectively coupled to the second byte pads of the second channel, and second byte pads of the second die are respectively coupled to the first byte pads of the second channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.