Fingerprint sensor housing with non-uniform thickness
US12026971B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2023 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Mar 6, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1329
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.