Shengmin Wen
6Patents
2h-index
8Co-inventors
36Inventor score
Filing activity: Dec 18, 2015 → Mar 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10921855B1 | Interposer for a display driver integrated circuit chip | Electricity | 4 | Active |
| US10055631B1 | Semiconductor package for sensor applications | Electricity | 3 | Active |
| US9785821B2 | Capacitive sensor architecture for biometric sensing | Physics | 0 | Active |
| US11625945B2 | Fingerprint sensor housing with non-uniform thickness | Physics | 0 | Active |
| US12026971B2 | Fingerprint sensor housing with non-uniform thickness | Physics | 0 | Active |
| US10338754B2 | Edge-effect mitigation for capacitive sensors | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.