Substrate processing apparatus and substrate processing method
US12027402B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Jan 30, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/37555
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adjusting system is controlled such that an arrangement of the substrate is adjusted based on detection by a first sensor, and a second sensor is controlled to detect a characteristic point formed in advance on a plate surface of the substrate, wherein the arrangement of the substrate has been adjusted based on the detection by the first sensor. Moreover, it is checked whether a position of the characteristic point detected by the second sensor is within an allowable range, and the adjusting system is controlled to adjust the arrangement of the substrate based on the detection by the second sensor when the position of the characteristic point detected by the second sensor is within the allowable range, and the attaching/detaching system is controlled to attach the substrate to the substrate holder after the arrangement of the substrate is adjusted based on the detection by the second sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.