Thermal interface material, an integrated circuit formed therewith, and a method of application thereof
US12027442B1 · kind B1 · utility
0Cited by
3References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2023 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Dec 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/095
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material, an integrated circuit formed therewith, and a method of application thereof are provided. The thermal interface material includes 5% to 30% by volume of a polymer component and at least 70% by volume of liquid metal droplets, all based on total volume of the thermal interface material. The polymer component has a first polymer having a molecular weight in a range of 400 g/mol to 400,000 g/mol. The liquid metal droplets are dispersed throughout the polymer component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.