Electronic package and carrier thereof and method for manufacturing the same
US12027484B2 · kind B2 · utility
1Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2021 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Sep 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68345
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.