Shielded printed wiring board, method for manufacturing shielded printed wiring board, and connecting member
US12028964B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 17, 2020 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | May 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member. The shielded printed wiring board of the present invention includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; a connecting member including a metal foil and a conductive filler fixed to the metal foil with an adhesive resin; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the electromagnetic wave shielding film is arranged on the substrate film in such a manner that the insulating layer of the electromagnetic wave shielding film is located on the shielding layer of the electromagnetic wave shie…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.