Method of selective laser solidification
US12030245B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2022 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Dec 19, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Selective laser solidification apparatus is described that includes a powder bed onto which a powder layer can be deposited and a gas flow unit for passing a flow of gas over the powder bed along a predefined gas flow direction. A laser scanning unit is provided for scanning a laser beam over the powder layer to selectively solidify at least part of the powder layer to form a required pattern. The required pattern is formed from a plurality of stripes or stripe segments that are formed by advancing the laser beam along the stripe or stripe segment in a stripe formation direction. The stripe formation direction is arranged so that it always at least partially opposes the predefined gas flow direction. A corresponding method is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.