Method for producing a wafer connection

US12030773B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Friedjof Heuck · Stuttgart, DE
• Jochen Tomaschko · Herrenberg, DE
• Peter Schmollngruber · Aidlingen, DE
• Thomas Friedrich · Bietigheim-Bissingen, DE
• Volkmar Senz · Metzingen, DE
• Franziska Rohlfing · Leonberg, DE

Key dates

• Filing date: Sep 24, 2019
• Grant date: Jul 9, 2024
• Expiry date: Sep 24, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0792
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for producing a wafer connection between a first and a second wafer. The method includes providing a first and second material for forming a eutectic alloy, providing a first wafer having a receiving structure for a die structure, filling the receiving structure with the first material, providing a second wafer having a die structure, the second material being situated on the die structure, providing a stop structure on the first and/or second wafer, so that when the two wafers are joined, a defined stop is provided, heating the first and second material at least to the eutectic temperature of the eutectic alloy, joining the first and second wafer so that the die structure is at least partly introduced into the receiving structure, the stop structure, the receiving structure, the die structure.