Method for producing an electronic component which includes a self-assembled monolayer
US12035546B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2019 |
| Grant date | Jul 9, 2024 |
| Priority date | — |
| Expiry date | Sep 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K10/701
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for the production of an electronic component comprising a self-assembled monolayer (SAM) using compounds of the formula I R1-(A1-Z1)r—(B1)n—(Z2-A2)s-Sp-G (I) in which the groups occurring have the meanings defined in Claim 1; the present invention furthermore relates to the use of the components in electronic switching elements and to compounds for the production of the SAM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.