Liquid molding compound and preparation method thereof
US12037488B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2024 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Apr 18, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/322
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The disclosure provides a liquid molding compound and preparation method thereof, belonging to the technical field of semiconductor packaging. The liquid molding compound includes: the following components in mass fraction, a filler 83%-88%, an epoxy resin 6%-9%, a curing agent 6%-9%, a colorant 0.1%-0.2%, an accelerator 0.1%-0.3%, and a paraffin oil 0.3%-0.6%; by adding paraffin oil that has a small surface activity, paraffin oil does not participate in the reaction between epoxy resin and curing agent, is easily compatible with epoxy resin, and easy to precipitate under heating conditions. The precipitated paraffin oil forms a spacer layer between the colloid surface and the thermal release tape. The paraffin oil of the spacer layer has almost no adhesion to the acrylic adhesive on the thermal release tape, so the thermal release tape can be easily removed at a certain temperature to achieve the effect of no residual adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.