Polishing slurry composition and method for producing same
US12037516B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | May 29, 2019 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Dec 30, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1436
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to a polishing slurry composition and a method of producing the same. The polishing slurry composition according to one embodiment of the present disclosure includes: abrasive particles dispersed so as to have positively-charged particle surfaces; a first dispersant including a nonionic linear polymer; and a second dispersant including an anionic coiling polymer, wherein the polishing slurry composition satisfies the following Expressions 1 and 2: [Expression 1] 4≤log(milling energy)<5; and [Expression 2] 20%≤Primary particle size reduction rate (%)<35%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.