Processor package with universal optical input/output
US12038858B2 · kind B2 · utility
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2References
22Claims
0Family size
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Key dates
| Filing date | Oct 9, 2020 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Nov 1, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/40
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A processor package module comprises a substrate, one or more compute die mounted to the substrate, and one or more photonic die mounted to the substrate. The photonic die have N optical I/O links to transmit and receive optical I/O signals using a plurality of virtual optical channels, the N optical I/O links corresponding to different types of I/O interfaces excluding power and ground I/O. The substrate is mounted into a socket that support the power and ground I/O and electrical connections between the one or more compute die and the one or more photonic die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.