Mechanical couplings designed to resolve process constraints
US12040197B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2021 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | Sep 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.