Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices
US12040263B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2021 |
| Grant date | Jul 16, 2024 |
| Priority date | — |
| Expiry date | May 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged semiconductor device includes a substrate having a first surface and a second surface opposite the first surface. At least one semiconductor die is mounted at the first surface of the substrate. Electrically-conductive leads are arranged around the substrate, and electrically-conductive formations couple the at least one semiconductor die to selected leads of the electrically-conductive leads. A package molding material is molded onto the at least one semiconductor die, onto the electrically-conductive leads and onto the electrically-conductive formations. The package molding material leaves the second surface of the substrate uncovered by the package molding material. The substrate is formed by a layer of electrically-insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.