Radio-frequency devices and methods for producing radio-frequency devices

US12040543B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Walter Hartner · Munich, DE
• Tuncay ERDOEL · Unterhaching, DE
• Klaus Elian · Alteglofsheim, DE
• Christian Geissler · Teugn, DE
• Bernhard Rieder · Regensburg, DE
• Rainer Markus Schaller · Kelheim, DE
• Horst Theuss · Wenzenbach, DE
• Maciej Wojnowski · Munich, DE

Key dates

• Filing date: Jan 24, 2022
• Grant date: Jul 16, 2024
• Expiry date: May 2, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q23/00
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.