Polishing system, polishing pad and method of manufacturing semiconductor device
US12042900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2022 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Oct 12, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a polishing system in which accuracy and easiness of attachment and detachment of a polishing pad to a surface plate are maximized, the polishing system including: a surface plate having a polishing pad mounted on an upper portion; and the polishing pad mounted on the surface plate, in which the polishing pad includes: a polishing surface and a surface plate attachment surface that is a rear surface of the polishing surface, the surface plate attachment surface includes: at least one engraved portion, the surface plate includes at least one embossed portion, and the embossed portion and the engraved portion have a complementary coupling structure, and a method of manufacturing a semiconductor device to which the polishing system is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.