Sensor system with a microelectromechanical sensor element and method for producing a sensor system

US12043539B2 · kind B2 · utility

Assignee

• Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

• Dirk Meinhold · Dresden, DE
• Steffen Bieselt · Wehlen, DE
• Claudia HENGST · Dresden, DE
• Daniel Koehler · Althengstett, DE
• Erhard Landgraf · Dresden, DE
• Sebastian PREGL · Dresden, DE

Key dates

• Filing date: Apr 8, 2022
• Grant date: Jul 23, 2024
• Expiry date: Jun 24, 2042

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0771
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A sensor system with a first semiconductor die part and with a second semiconductor die part is proposed, wherein the first semiconductor die part has a microelectromechanical sensor element, wherein the second semiconductor die part covers the microelectromechanical sensor element, wherein the second semiconductor die part has a via for electrically contacting the microelectromechanical sensor element, in particular directly. A method for producing a sensor system is also proposed.