Resist underlayer film-forming composition
US12044969B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2020 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Jul 14, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2650/56
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resist underlayer film-forming composition revealing high reflow properties while applying and heating the composition on a substrate, allowing a flat application on a multi-level substrate thus forming a flat film. The composition includes a copolymer having a repeating structural unit of the following Formula (1) and/or a repeating structural unit of the following Formula (2) and an organic solvent: (in Formulae (1) and (2), R1 is a functional group of Formula (3); in Formula (3), Q1 and Q2 are each independently a hydrogen atom or a C1-5 alkyl group, and * is a dangling bond to an oxygen atom; and in Formula (2), X1 is a C1-50 organic group, and i and j are each independently 0 or 1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.