Chuck for processing semiconductor workpieces at high temperatures
US12046503B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2021 |
| Grant date | Jul 23, 2024 |
| Priority date | — |
| Expiry date | Jul 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chuck for heating and clamping a workpiece, such as a semiconductor workpiece, is disclosed. The chuck is configured to allow the workpiece to be heated to temperatures in excess of 600° C. Further, while the workpiece is heating, the components that make up the chuck may be maintained at a much lower temperature, such as room temperature. The chuck includes a housing, formed as a hollow cylinder with sidewalls and an open end. Electrodes are disposed at the top surface of the sidewalls to clamp the workpiece. A heat source is disposed in the cavity and emits radiated heat toward the workpiece. A clamp ring may be used to secure the workpiece. In some embodiments, a thermal sensor is used to monitor the temperature of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.