Systems and methods for reducing effluent build-up in a pumping exhaust system
US12049698B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2022 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | May 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for reducing effluent buildup in a pumping exhaust system of a substrate processing system includes, during a substrate treatment process, arranging a substrate on a substrate support in a processing chamber; supplying one or more process gases to the processing chamber; supplying an inert dilution gas at a first flow rate to the pumping exhaust system; performing the substrate treatment process on the substrate in the processing chamber; evacuating reactants from the processing chamber using the pumping exhaust system. The method includes, after the substrate treatment process, supplying cleaning plasma including cleaning gas in the processing chamber during a cleaning process; and supplying the inert dilution gas at a second flow rate that is less than the first flow rate to the pumping exhaust system during the cleaning process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.