Plasma processing apparatus and plasma processing method
US12051575B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2021 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Jul 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is a processing state detection unit includes: a light emission detection unit configured to detect light emission of the plasma; a calculation unit configured to obtain a differential waveform data of the light emission of the plasma; a database unit that stores a plurality of pieces of differential waveform pattern data in advance; a film thickness calculation unit configured to calculate an estimated value of the film thickness of the processing target film processed on the processing target material by weighting based on differences between the differential waveform data obtained by the calculation unit and the plurality of pieces of differential waveform pattern data stored in the database unit; and an end point determination unit configured to determine an end point of processing using the plasma based on the estimated value of the film thickness of the processing target film calculated by the film thickness calculation unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.